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3#
发表于 2007-5-6 16:31:58
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来自: 江苏苏州 来自 江苏苏州
先把洋和尚念的经放在这里:
What does the hole in the P4 heatspreader do?
Author: W1zzard Date: May 24th 2004
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The hole in the P4's heat spreader is a result of the manufacturing process. The IHS is glued to the processor substrate with epoxy at the Intel plant. The hole allows gases and pressure to escape while the epoxy cures. Without the hole the pressure would deform the epoxy bond and make the connection between substrate and IHS uneven.
It is perfectly safe to cover and/or fill it with thermal paste.
[ 本帖最后由 张先生 于 2007-5-6 17:06 编辑 ] |
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