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标题: 名牌内存厂商DDR-Ram使用芯片列表 [打印本页]

作者: 张先生 时间: 2007-5-6 13:07
标题: 名牌内存厂商DDR-Ram使用芯片列表
DDR-Ram Chip List

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A-Data
PC2700 (cl2,5) could be Winbond AH-6 or BH-6
PC3200 Winbond CH-5, Samsung TCCC
PC3200 Special Edition Winbond BH-5
PC4000 (3-4-4-8) Hynix D43, D5, Samsung TCCC
PC4000 Vitesta (3-4-4-8) Hynix D43, D5
PC4500 Vitesta  Samsung TCCD
PC4800 Vitesta  Hynix B

Apacer
PC2700 could be Winbond AH-6

Buffalo
PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the
chips
PC3700 may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at
the chips
FireStix PC4000 Hynix B

Corsair
XMS-PC2700C2 Rev1.1 (2-3-3-6-1T) maybe Winbond BH-6
XMS-PC2700C2 Rev1.2 (2-3-3-6-1T) Winbond CH-6
XMS-PC2700C2 Rev2.1 (2-3-3-6-1T) Micron (6ns?)
XMS-PC2700LL Rev1.1 (2-2-2-6-1T) Winbond BH-6
XMS-PC2700LL Rev1.2 (2-2-2-6-1T) Winbond CH-6
XMS-PC3000C2 Rev1.1 (2-3-3-6-1T) Samsung TCB3 and few Winbond BH-6
XMS-PC3200C2 Rev1.1/2.1 (2-3-3-6-1T) Winbond BH-6
XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) Winbond CH-6
XMS-PC3200C2 Rev3.1 (2-3-3-6-1T) Infineon B-5 (not sure, maybe Winbond CH-6)
XMS-PC3200C2 Rev4.1 (2-3-3-6-1T) Samsung TCCD
XMS-PC3200C2 Rev4.2 (2-3-3-6-1T) should Samsung TCCD
XMS-PC3200LL Rev1.1/2.1 (2-2-2-6-1T) Winbond BH-5
XMS-PC3200LL Rev1.2/2.2 (2-3-2-6-1T) Winbond CH-5
XMS-PC3200LL Rev3.1 (2-3-2-6-1T) Infineon B-5
XMS-PC3200XL Rev1.1 (2-2-2-5-1T) Samsung TCCD
XMS-PC3500C2 Rev1.1 (2-3-3-7-1T) Winbond BH-5
XMS-PC3700 Rev1.1(3-4-4-8-1T) Samsung TCCC
XMS-PC4000 Rev1.1 (3-4-4-8-1T) Hynix D43
XMS-PC4400 Rev1.1 (3-4-4-8-1T) Hynix D5

Crucial
PC3200 may or may not contain Micron 46V32M8 -5B C, 46V32M8 -5B G
Ballistix PC3200 (2-2-2-8) Micron 46V32M8 -5B G (maybe overlabeled)
Ballistix PC4000 (2.5-4-4-8) Micron 46V32M8 -5B G (maybe overlabeled)

GeIL
Value PC3200 Blue (2.5-3-3-6) Infineon 5ns, Hynix D5, D43
Golden Dragon PC3200 (2-3-3-6-1T) WLCSP chip package w/ Samsung chips
Ultra Platinum PC3200 (2-3-3-6-1T) Winbond CH-5, Mosel Vitelic 5ns
Golden Dragon PC3500 (2.5-3-3-6-1T) WLCSP chip package w/ Samsung chips
Ultra Platinum PC3500 (2.5-3-3-6-1T) Winbond CH-5, Mosel Vitelic 5ns
Golden Dragon PC3700 (2.5-4-4-7-1T) WLCSP chip package w/ Samsung chips
Golden Dragon PC4000 (2.5-4-4-7-1T) WLCSP chip package w/ Samsung chips
Ultra Platinum PC4000 (3-4-4-8-1T) Hynix D43
Ultra Platinum PC4200 (3-4-4-8-1T) Hynix D43
Ultra Platinum PC4400 (3-4-4-8-1T) Hynix D5

Kingston
HyperX PC2700 (2-2-2-5-1T) (KHX 2700) first Samsung TCB3, then Winbond BH-6,  CH-6, CH-5, relabeled
unknown Chips.
HyperX PC3000 (2-2-2-6-1T) (KHX 3000) first Samsung TCB3, then mainly Winbond  BH-5, some BH-6, CH-5, CH-6
(maybe relabeled)
HyperX PC 3200 (old revision, not AK2, K2 or A) (KHX 3200) Winbond BH-5
HyperX PC 3200K2 (2-2-2-6-1T) (KHX 3200K2) Winbond BH-5
HyperX PC 3200AK2 (2-3-2-6-1T) (KHX 3200AK2) Winbond CH-5
HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2) Samsung TCCD
HyperX PC 3500 (rated 2-3-3-7 @ 433Mhz, 2-2-2-6 @ 400Mhz, old revision)
(KHX 3500) Winbond BH-5 (maybe relabeled)
HyperX PC 3500K2 (2-3-3-7) (KHX 3500K2) Winbond CH-5
HyperX PC 4000K2 (3-4-4-8) (KHX 4000K2) Samsung TCCC, Hynix D43, D5
HyperX PC 4300K2 (3-4-4-8) (KHX 4300K2) Hynix D5
Kingston Ram w/remarked Chips as D328DW-45  Before Week 18 Year 03 Winbond BH-5, after CH-5 (18 03 can be both)
Kingston Ram w/remarked Chips as D328DW-5  Winbond BH-5
Kingston Ram w/remarked Chips as D328DW-6 Winbond BH-6
Kingston Ram w/remarked Chips as D328DM-6 should Winbond BH-6
Kingston Ram w/remarked Chips as D328DM-5 should Winbond BH-5
Value Ram 333Mhz (2,5-3-3-*) (KVR333X64C25) may or may not contain Winbond BH-6, AH-6, Hynix D43, D5 look at the chips (maybe relabeled)
Value Ram 400Mhz (2,5-3-3-*) (KVR400X64C25) may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C, Hynix
D43, D5, Samsung TCCC, TCC4 look at the chips (maybe relabeled)

Mushkin
PC3200 Cl2,5 (Non Level X, non Blue, Green Serie) Winbond BH-5, Samsung TCB3
PC3200 (Non Level X, rated 2-2-2-6, Promo Build) Winbond BH-5
PC3200 Level I  Winbond CH-5
PC3200 Level II  Winbond BH-5 or BH-6
PC3200 Special 2-2-2 Winbond BH-6
PC3200 Level II V2 Samsung TCCD
PC3500 Level I  Winbond CH-5
PC3500 Level II Winbond BH-5

OCZ
EL DDR PC3200 Platinum Limited Edition (2-2-2-7) Winbond BH-6
EL DDR PC3200 Platinum Edition (2-3-2-5) Samsung TCB3, ProMOS 5ns (relabeled), Mosel Vitelic 5ns (relabeled), Winbond CH-5
EB DDR PC3200 Platinum Edition (2,5-3-2-8) Micron 46V32M8 -5B C
EL DDR PC3200 Platinum Edition rev2 (2-2-2-6) Samsung 4ns TCCD
EL DDR PC3500 Platinum Limited Edition (2-2-3-6) Winbond BH-5
EL DDR PC3500 Platinum Edition (2-3-2-5) Winbond CH-5, few BH-5
EB DDR PC3500 Platinum Edition (2,5-3-2-8) Micron 46V32M8 -5B C
EL DDR PC3700 Gold Edition rev1 (2-3-3-7) Samsung TCB3 (overlabeled)
EL DDR PC3700 Gold Edition rev2 (2,5-3-3-7) ProMOS 5ns (relabeled) , Mosel Vitelic 5ns (relabeled)
EB DDR PC3700 Platinum Edition (3-2-2-8/3-3-2-8) Micron 46V32M8 -5B C
DDR PC4000 (3-4-4-8) Hynix D5, D43 (relabeled)
DDR PC4200 (3-4-4-8) Hynix D5, D43
DDR PC4400 (3-4-4-8) Hynix D5
EL DDR PC4400 Gold Edition (2,5-4-4-8) Hynix B

Samsung
PC3200 Samsung TCC4, TCCC
PC4000 CL3 Samsung TCCD

Shikatronics
ShikaXram PC4400 (3-4-4-8) Hynix B

TwinMos
Twinmos DDR333 (2,5-3-3-6) Samsung TCB3, TCC4 Winbond AH-6, Winbond BH-6, Twinmos, Hynix, Mtec
Twinmos/Winbond DDR400 (2,5-3-3-6) Could be Winbond BH-5, CH-5, look at the chips
Twinmos Twisters DDR500 (TSOP) (3-4-4-8) Hynix D43, Samsung TCCC
Twinmos Twisters DDR533 (3-4-4-8) Hynix D5

Ultra
Extreme Memory PC3200 DDR 400MHZ (2-2-2-5-1T) Winbond BH-5, selected CH-5

[ 本帖最后由张先生于 2007-5-6 13:08 编辑 ]

作者: 风云缘证三生 时间: 2007-5-6 13:11
虽然看不大懂，还是谢谢张老师

作者: 张先生 时间: 2007-5-6 13:33
前面是具体的内存条，后面是使用的芯片牌号

作者: 二十八画生 时间: 2007-5-6 21:17
先收下了,谢谢

作者: 炙天使 时间: 2007-5-7 23:12
好东东顶

作者: 烟台佰和数码 时间: 2007-5-8 15:07
是啊，，不懂啊。。

作者: 烟台佰和数码 时间: 2007-5-8 15:08
是啊，，不懂啊。。

作者: 天若有情 时间: 2007-5-9 01:06
提示: 作者被禁止或删除内容自动屏蔽

作者: chaob18 时间: 2007-5-9 07:39
虽然看不大懂，还是谢谢张老师

作者: 后来者 时间: 2007-5-15 20:55
提示: 作者被禁止或删除内容自动屏蔽

作者: 阿里 时间: 2007-9-15 22:21
THANKS YOU

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